Debut at the 28th China Hi-Tech Fair: Full-Chain High-Density Liquid Cooling Solution Lands in Shenzhen
—Gotcool Sincerely Invites Upstream/Downstream Partners and Industry Colleagues to Visit Booth 6-B9, Hall 6 for Exchange and Negotiation
Rendering of Gotcool's booth at the 28th China Hi-Tech Fair (Hall 6, Booth 6-B9)
From November 26 to 28, 2026, the 28th China International High-Tech Achievement Fair (hereinafter referred to as the "Hi-Tech Fair") will be grandly held at the Shenzhen International Convention and Exhibition Center (Bao'an). Gotcool Heat Transfer Technology (Beijing) Co., Ltd. will showcase its high-density liquid cooling full-chain products and solutions at this prestigious event, with the booth located at 6-B9, Hall 6.
We sincerely invite upstream and downstream partners from data centers, intelligent computing centers, server and chip fields, as well as industry colleagues who focus on liquid cooling technology, to visit our booth for a close-up understanding of Gotcool's liquid cooling technical strength and product family, and to discuss the path of thermal management in the era of high-density computing power.
About the Hi-Tech Fair: China's No.1 Technology Exhibition
Known as "China's No.1 Technology Exhibition," the Hi-Tech Fair is one of China's largest and most influential national-level comprehensive technology exhibitions. With the theme of "Technology Leads Development, Industry Integration and Aggregation," this year's fair is expected to cover an exhibition area of 400,000 square meters, with over 5,000 domestic and overseas enterprises showcasing cutting-edge scientific and technological achievements, focusing on the latest breakthroughs in artificial intelligence, next-generation information technology, high-end equipment and other fields.
As an important window to observe the trends of China's scientific and technological innovation, the Hi-Tech Fair is an excellent stage for enterprises to demonstrate hardcore technologies and connect with industrial resources. Gotcool's participation this time aims to leverage this national-level platform to fully present its years of technical accumulation and engineering practice in liquid cooling thermal management to partners in the computing power industry chain.
