Debut at the 28th China Hi-Tech Fair: Full-Chain High-Density Liquid Cooling Solution Lands in Shenzhen
From November 26 to 28, 2026, the 28th China International High-Tech Achievement Fair (hereinafter referred to as the "Hi-Tech Fair") will be grandly held at the Shenzhen International Convention and Exhibition Center (Bao'an). Gotcool Heat Transfer Technology (Beijing) Co., Ltd. will showcase its high-density liquid cooling full-chain products and solutions at this prestigious event, with the booth located at 6-B9, Hall 6.
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